Firan Technology Group Corp. (TSE:FTG) Insider Christopher Woodland Sells 34,900 Shares
Firan Technology Group Corp. (TSE:FTG) insider Christopher Woodland sold 34,900 shares of the stock in a transaction that occurred on Thursday, August 3rd. The stock was sold at an average price of C$3.51, for a total value of C$122,499.00.
Christopher Woodland also recently made the following trade(s):
- On Monday, July 31st, Christopher Woodland sold 200 shares of Firan Technology Group Corp. stock. The stock was sold at an average price of C$3.96, for a total value of C$792.00.
Firan Technology Group Corp. (TSE FTG) traded up 0.27% on Friday, reaching $3.75. The company’s stock had a trading volume of 4,300 shares. The stock has a market capitalization of $84.49 million and a P/E ratio of 17.69. The firm has a 50 day moving average price of $4.20 and a 200 day moving average price of $4.12. Firan Technology Group Corp. has a 52 week low of $2.35 and a 52 week high of $4.84.
Firan Technology Group Corp. (TSE:FTG) last announced its quarterly earnings data on Monday, July 17th. The company reported $0.01 earnings per share (EPS) for the quarter, missing the Thomson Reuters’ consensus estimate of $0.06 by $0.05. Firan Technology Group Corp. had a net margin of 2.95% and a return on equity of 8.98%. The company had revenue of $25.51 million for the quarter, compared to analysts’ expectations of $26.80 million. On average, equities analysts anticipate that Firan Technology Group Corp. will post $0.19 EPS for the current year.
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Firan Technology Group Corp. Company Profile
Firan Technology Group Corporation (FTG) is a supplier of aerospace and defense electronic products and subsystems. The Company operates through two segments: FTG Circuits and FTG Aerospace. The FTG Circuits is a manufacturer of technology printed circuit boards. Its product offering includes engineering services, Microvia technology, buried capacitance, cavity boards, metal core constructions, multiple sequential laminations, differential and controlled impedance, embedded filters and inductors, buried resistor layers, back drilling and back planes.
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