Amkor Technology, Inc. (AMKR) Scheduled to Post Quarterly Earnings on Monday
Amkor Technology, Inc. (NASDAQ:AMKR) is scheduled to be issuing its quarterly earnings data after the market closes on Monday, October 30th. Analysts expect the company to announce earnings of $0.20 per share for the quarter. Amkor Technology has set its Q3 guidance at $0.10-0.27 EPS.
Amkor Technology (NASDAQ:AMKR) last issued its quarterly earnings results on Monday, July 31st. The semiconductor company reported $0.14 earnings per share (EPS) for the quarter, topping the Thomson Reuters’ consensus estimate of $0.11 by $0.03. Amkor Technology had a net margin of 6.63% and a return on equity of 12.95%. The company had revenue of $989.00 million during the quarter, compared to analyst estimates of $996.10 million. During the same quarter last year, the business posted $0.02 EPS. Amkor Technology’s quarterly revenue was up 7.9% compared to the same quarter last year. On average, analysts expect Amkor Technology to post $0.53 EPS for the current fiscal year and $0.85 EPS for the next fiscal year.
Shares of Amkor Technology, Inc. (NASDAQ AMKR) opened at 10.69 on Monday. Amkor Technology, Inc. has a 52 week low of $8.32 and a 52 week high of $12.48. The stock’s 50 day moving average is $10.07 and its 200 day moving average is $10.46. The stock has a market cap of $2.56 billion, a price-to-earnings ratio of 9.65 and a beta of 2.66.
A number of research analysts recently weighed in on AMKR shares. BidaskClub downgraded shares of Amkor Technology from a “buy” rating to a “hold” rating in a research report on Wednesday, June 28th. ValuEngine upgraded shares of Amkor Technology from a “buy” rating to a “strong-buy” rating in a research report on Tuesday, August 1st. Finally, Deutsche Bank AG restated a “hold” rating and set a $10.50 price objective (down previously from $12.00) on shares of Amkor Technology in a research report on Tuesday, August 1st.
About Amkor Technology
Amkor Technology, Inc is a provider of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance.
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