Chipmos Technologies (IMOS) Rating Lowered to Strong Sell at BidaskClub
Chipmos Technologies (NASDAQ:IMOS) was downgraded by equities research analysts at BidaskClub from a “sell” rating to a “strong sell” rating in a research note issued on Thursday.
A number of other research analysts have also recently weighed in on IMOS. Zacks Investment Research upgraded shares of Chipmos Technologies from a “sell” rating to a “hold” rating in a research note on Wednesday. ValuEngine upgraded shares of Chipmos Technologies from a “hold” rating to a “buy” rating in a research note on Saturday, November 4th.
Chipmos Technologies (NASDAQ IMOS) traded down $0.04 on Thursday, reaching $17.62. 82,642 shares of the company’s stock were exchanged, compared to its average volume of 69,746. The company has a current ratio of 2.38, a quick ratio of 2.08 and a debt-to-equity ratio of 0.47. The stock has a market capitalization of $786.31 and a PE ratio of 13.25. Chipmos Technologies has a 52-week low of $15.24 and a 52-week high of $21.99.
Several hedge funds have recently made changes to their positions in IMOS. Group One Trading L.P. purchased a new stake in shares of Chipmos Technologies during the 2nd quarter valued at approximately $113,000. Parametric Portfolio Associates LLC purchased a new stake in shares of Chipmos Technologies during the 2nd quarter valued at approximately $209,000. FDx Advisors Inc. purchased a new stake in shares of Chipmos Technologies during the 3rd quarter valued at approximately $248,000. Virtu KCG Holdings LLC purchased a new stake in shares of Chipmos Technologies during the 2nd quarter valued at approximately $370,000. Finally, Parallax Volatility Advisers L.P. purchased a new stake in shares of Chipmos Technologies during the 2nd quarter valued at approximately $395,000. Institutional investors own 16.40% of the company’s stock.
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About Chipmos Technologies
ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services, among others.
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