Critical Survey: ANADIGICS (ANAD) and The Competition
ANADIGICS (NASDAQ: ANAD) is one of 27 publicly-traded companies in the “Integrated Circuits” industry, but how does it contrast to its rivals? We will compare ANADIGICS to related companies based on the strength of its earnings, profitability, dividends, analyst recommendations, institutional ownership, risk and valuation.
Valuation & Earnings
This table compares ANADIGICS and its rivals revenue, earnings per share (EPS) and valuation.
|Gross Revenue||Net Income||Price/Earnings Ratio|
|ANADIGICS Competitors||$697.41 million||$99.19 million||398.90|
This is a summary of current ratings and recommmendations for ANADIGICS and its rivals, as provided by MarketBeat.
|Sell Ratings||Hold Ratings||Buy Ratings||Strong Buy Ratings||Rating Score|
As a group, “Integrated Circuits” companies have a potential upside of 11.23%. Given ANADIGICS’s rivals higher possible upside, analysts clearly believe ANADIGICS has less favorable growth aspects than its rivals.
Insider and Institutional Ownership
56.0% of shares of all “Integrated Circuits” companies are held by institutional investors. 14.3% of shares of all “Integrated Circuits” companies are held by company insiders. Strong institutional ownership is an indication that hedge funds, endowments and large money managers believe a company will outperform the market over the long term.
This table compares ANADIGICS and its rivals’ net margins, return on equity and return on assets.
|Net Margins||Return on Equity||Return on Assets|
ANADIGICS rivals beat ANADIGICS on 8 of the 8 factors compared.
ANADIGICS Company Profile
ANADIGICS, Inc. is engaged in the designing and manufacturing of radio frequency (RF) semiconductor solutions for infrastructure and mobile communications and data transmission markets. The Company’s product portfolio includes line amplifiers, reverse path amplifiers, power amplifiers (PAs) and front-end integrated circuits (FEIC). The Company designs, develops, and manufactures RFIC’s primarily using GaAs compound semiconductor substrates with various process technologies, including metal semiconductor field effect transistor (MESFET), pseudomorphic high-electron-mobility transistor (pHEMT) and heterojunction bipolar transistor (HBT). The Company’s InGaP-Plus technology, combines InGaP HBT and pHEMT processes on a single substrate and integrates the PA function and the RF active switch function on the same die. Additionally, the Company offers VCSEL process technology. The Company fabricates its ICs in its six-inch diameter GaAs wafer fabrication facility.
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