ChipMOS Technologies Inc – (NASDAQ:IMOS) announced an annual dividend on Thursday, August 9th, NASDAQ reports. Investors of record on Friday, October 19th will be paid a dividend of 0.135 per share by the semiconductor company on Friday, October 19th. This represents a yield of 0.88%. The ex-dividend date of this dividend is Thursday, October 18th.
ChipMOS Technologies has raised its dividend by an average of 4.0% annually over the last three years.
Shares of IMOS opened at $15.10 on Friday. The company has a quick ratio of 2.06, a current ratio of 2.48 and a debt-to-equity ratio of 0.41. ChipMOS Technologies has a 52-week low of $12.69 and a 52-week high of $21.64. The firm has a market capitalization of $656.05 million, a price-to-earnings ratio of 15.89 and a beta of 0.48.
ChipMOS Technologies (NASDAQ:IMOS) last issued its quarterly earnings data on Thursday, August 9th. The semiconductor company reported $0.10 earnings per share (EPS) for the quarter, missing the Thomson Reuters’ consensus estimate of $0.17 by ($0.07). ChipMOS Technologies had a net margin of 2.71% and a return on equity of 2.91%. The business had revenue of $147.60 million during the quarter, compared to the consensus estimate of $145.24 million. During the same quarter in the previous year, the firm posted $0.25 EPS. The company’s revenue for the quarter was down 1.1% compared to the same quarter last year.
A number of equities research analysts have recently weighed in on the company. BidaskClub upgraded ChipMOS Technologies from a “sell” rating to a “hold” rating in a research report on Tuesday, September 25th. ValuEngine downgraded ChipMOS Technologies from a “hold” rating to a “sell” rating in a research report on Wednesday, September 12th.
About ChipMOS Technologies
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors.
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