Short Interest in AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (OTCMKTS:ASAAF) Rises By 93.7%

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (OTCMKTS:ASAAF) was the target of a significant growth in short interest in May. As of May 29th, there was short interest totaling 6,667 shares, a growth of 93.7% from the May 14th total of 3,442 shares. Based on an average daily trading volume, of 627 shares, the days-to-cover ratio is presently 10.6 days.

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Price Performance

ASAAF stock opened at C$162.65 on Friday. The business has a 50 day moving average of C$117.47 and a 200-day moving average of C$69.57. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft has a 12-month low of C$17.23 and a 12-month high of C$170.06.

Analyst Upgrades and Downgrades

ASAAF has been the topic of several recent analyst reports. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft in a research note on Friday, May 15th. Cantor Fitzgerald started coverage on shares of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft in a report on Thursday, May 7th. They issued an “overweight” rating for the company. Two investment analysts have rated the stock with a Buy rating, Based on data from MarketBeat.com, the stock currently has an average rating of “Buy”.

About AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (OTCMKTS: ASAAF) is a leading European manufacturer of high-end printed circuit boards (PCBs) and advanced packaging substrates. Headquartered in Leoben, Austria, the company specializes in the design, development and production of rigid and flex-rigid circuit boards, high density interconnect (HDI) PCBs and multi-layer structures tailored for demanding applications across various industries.

The company’s core product portfolio includes HDI boards, rigid-flex solutions, advanced IC substrates and mid-to-high layer count PCBs.