BE Semiconductor Industries (OTCMKTS:BESIY) Shares Down 8% Following Weak Earnings

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY) were down 8% during mid-day trading on Thursday following a weaker than expected earnings announcement. The stock traded as low as $261.00 and last traded at $261.00. Approximately 1,664 shares were traded during trading, a decline of 79% from the average daily volume of 7,745 shares. The stock had previously closed at $283.80.

The technology company reported $1.29 EPS for the quarter, missing the consensus estimate of $1.30 by ($0.01). The company had revenue of $290.52 million for the quarter, compared to analyst estimates of $285.58 million. BE Semiconductor Industries had a return on equity of 51.09% and a net margin of 28.42%.

Wall Street Analyst Weigh In

BESIY has been the subject of several analyst reports. Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, June 26th. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Finally, Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Five investment analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the company. Based on data from MarketBeat.com, the company has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Stock Down 1.4%

The firm has a market cap of $18.58 billion, a P/E ratio of 84.02 and a beta of 1.97. The firm’s 50-day moving average price is $314.36 and its 200 day moving average price is $257.88. The company has a debt-to-equity ratio of 1.11, a current ratio of 4.74 and a quick ratio of 4.17.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.