BE Semiconductor Industries (BESIY) Projected to Post Quarterly Earnings on Thursday

BE Semiconductor Industries (OTCMKTS:BESIY) is projected to release its results before the market opens on Thursday, February 19th. Analysts expect BE Semiconductor Industries to post earnings of $0.62 per share for the quarter.

BE Semiconductor Industries Trading Up 1.8%

Shares of BESIY opened at $205.56 on Thursday. The company has a current ratio of 5.75, a quick ratio of 5.02 and a debt-to-equity ratio of 1.46. BE Semiconductor Industries has a 52-week low of $88.02 and a 52-week high of $210.76. The business’s fifty day moving average is $179.29 and its 200-day moving average is $159.59.

Wall Street Analysts Forecast Growth

A number of equities research analysts have recently weighed in on BESIY shares. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Kepler Capital Markets cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research report on Wednesday, October 15th. Finally, Needham & Company LLC upgraded BE Semiconductor Industries to a “buy” rating in a research report on Tuesday, January 6th. Five investment analysts have rated the stock with a Buy rating and five have assigned a Hold rating to the company’s stock. According to MarketBeat, the company has an average rating of “Moderate Buy”.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.